Organizations

Legislation RoHS/
WEEE/EU Directive

Companies


 

SMART Group
IPC Pb-Free Info
SolderTec
CALCE Pb-Free Info Center
NEMI Pb-Free Initiatives
NPL Pb-Free News & Info
Indium Corporation




Comprehensive Talent

Applications Engineers provide in-depth technical assistance to our customers. Their mission is to assist in the selection of an Indium Corporation product best-suited for a specific application. Thoroughly knowledgeable in all facets of Materials Science as it applies to the electronics, semiconductor, and optoelectronic sectors, Applications Engineers provide expert advice in:

  • Alloy selection from our list of over 220 solders for specific customer applications.
  • Physical, mechanical and fatigue life properties of solders.
  • Substrate metallization, flux, and alloy compatibility.
  • Solder preform, wire, and ribbon selection Soldering and bonding to a variety of substrates.
  • Applications and knowledge for the unique metal indium and indium chemicals.
  • Low melting alloys and fusible alloys applications and assistance.

Technical Support Engineers bring years of SMT expertise, and the knowledge of hundreds of key industry contacts, to your manufacturing floor. Their mission is to optimize the performance of your manufacturing process through proper and creative application of Indium Corporation’s material technologies.

When new interconnect materials are required, Technical Support Engineers act as the liaison between Indium Corporation’s Research and Development laboratory, outside experts, and our customers.

Indium Corporation’s Technical Support Engineers provide Rapid Response to all technical inquiries, usually within 24 hours.

E-mail Tech Support

Research and Development Scientists advance material science for the creation of new and unique products for electronics and optoelectronics assembly.

The team is headed by Dr. Ning-Cheng Lee, an SMTA Member of Distinction, author, and well known expert in materials science and SMT assembly.

Dr. Lee is the author of numerous award-winning papers, and two technical textbooks on SMT assembly and lead-free soldering. He has presented many courses at APEX, IMAPS, NEPCON, SMTA International, GlobalTronics and more.

View our Service Directory.

Full Range of Support

Indium’s Process Simulation Lab

Run process simulation test boards, evaluate solder pastes, and test other SMT assembly materials with our expert support.

The lab is equipped with:

  • Pick and place equipment
  • Infrared and forced air reflow ovens
  • Stencil printers
  • Wave solder equipment
  • Syringe dispensing equipment
  • More...

Test and inspection instrumentation includes:

  • MTS-Mechanical Strength Testing
  • Fatigue Testing
  • TGA
  • Infrared Spectrophotometer
  • Profilometer
  • SIRA
  • Metallurgical Microscopes
  • X-RAY
  • DSC
  • Wetting Balance
  • TMA
  • More...

Addressing Your Issues

Technical Support - when you need it. You have challenges, opportunities, and new processes to address. Indium’s technical expertise is available in several forms:

Online Support:
knowledge.indium.com
Available 24/7
Powerful, interactive, self-help technical knowledgebase
Customer-rated answers
Contact Our Tech Team:
techservice@indium.com
Training Workshops:
indium.com/bottomline
General or specific training
Your site or off-site
Customized to meet your needs
Site Visits:
Total focus on YOUR issues
Spotlight on your process
Service Directory

 
 

Europe Regulations
China Regulations
Japan Regulations

 

news courtesy of emsnow.com

Macroeconomic Pressures a Boon for Consumer Electronics
Aug 28, 2008 - While tighter budgets may be affecting the travel and tourism businesses, consumers are continuing to purchase electronics for the home and personal use
Robert Bosch to Increase Outsourcing to Taiwan This Year
Aug 28, 2008 - Robert Bosch GmbH of Germany will increase subcontract manufacturing orders to Taiwan and expand the operation of its Taiwan center for Internet-Protocol (IP) surveillance cameras this year, according to the company's Taiwan branch
IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session One Speakers
Aug 27, 2008 - Dale Lee of Plexus Corp., Doug Pauls of Rockwell Collins, Dr. Bill Kenyon of Global Centre Consulting, Dr. Ron Lasky of Indium/Dartmouth, and Lee Wilmot of TTM Technologies will be presenting during Session 1 on Industry Standards and Regulations
Palm Places Contract Order for Treo Pro Series Phone With HTC
Aug 27, 2008 - Palm Inc., has placed its contract order for the newest Treo Pro series 3.5G phones with Taiwan`s High Tech Computer Corp. (HTC), a handsets supplier, according to company sources
 
 
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